Overview
Electronic Series
Casting, Packaging, Bonding, Heat dissipation,
Conductive glue, Wafer bonding, etc.
Casting, Packaging, Bonding, Heat dissipation,
Conductive glue, Wafer bonding, etc.
Application
Electronics Resin and Varnish System:1. Electronic parts, Coil, Encapsulation and casting resin system
2. Protective and dust-proof varnish spray system
3. Temperature-resistant temperature sensing device resin
4. High-thermal conductive resin system